Author:
Hu Jin Ning,Huang Nick K. H.,Tseng Bin-Chyi
Cited by
3 articles.
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1. Comprehensive Optimization of Differential Via Design for High-Speed Applications;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
2. High-Speed Differential Via Optimization using a High-Accuracy and High-Bandwidth Via Model;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29
3. Optimizing the Placement of Non-Functional Pads on Signal Vias Using Multiple Reflection Analysis;2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI);2022-08-01