Author:
Jhong Ming-Fong,Pan Po-Chih,Cheng Hung-Hsiang,Wang Chen-Chao
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Signal Transmission Calibration Systems in Integrated Circuits;Machine Learning-based Design and Optimization of High-Speed Circuits;2023-12-31
2. Crosstalk Mitigation for High Speed SerDes Applications on FCBGA Package;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15
3. A Study on Transmission Loss of Build-up Film Applied to IC Substrate;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
4. A Low-Cost Antenna-in-Package (AiP) for D-Band Application;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
5. A D-Band Magnetoelectric Dipole Antenna-in-Package (AiP) Implemented on BT-Based Organic Substrate;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-10