A Study on Transmission Loss of Build-up Film Applied to IC Substrate-Reference-Cited by-同舟云学术

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A Study on Transmission Loss of Build-up Film Applied to IC Substrate

Published:2023-08-08 Issue: Volume: Page:1-5
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Kong Weikun¹,Chen Wenbo¹,Zhong Cheng¹,Chu Baojin²,Li Baozhong³,Yu Shuhui⁴

Affiliation:

1. Chinese Academy of Science,Shenzhen Institute of Advanced Technology,Shenzhen,China

2. University of Science and Technology of China,School of Chemistry and Materials Science,Hefei,China

3. Shenzhen CREBEST Semiconductor Materials Co., Ltd.,Shenzhen,China

4. Chinese Academy of Sciences,Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology,Shenzhen,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492264.pdf?arnumber=10492264

Reference8 articles.

1. Improving high-speed signal transmission loss by low conductor surface roughness

2. Transmission Line Loss Properties of Dielectric Loss Tangent and Conductive Surface Roughness in 5G Millimeter Wave Band

3. Signal transmission loss on printed circuit board in GHz frequency region

4. Accurate broadband modeling of multiconductor line RLGC-parameters in the presence of good conductors and semiconducting substrates

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