Author:
Wang Daixing,Pi Yudan,Wang Wei,Jin Yufeng
Cited by
3 articles.
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1. Thermal Interaction and Cooling of Electronic Device with Chiplet 2.5D Integration;Applied Sciences;2024-09-10
2. A fast and simple method to place sub-die under Chip-let architecture based on thermal simulation;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. A layout-to-simulation approach for thermal design of IC;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01