A review of power cycle driven fatigue, aging, and failure modes for semiconductor power modules-Reference-Cited by-同舟云学术

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A review of power cycle driven fatigue, aging, and failure modes for semiconductor power modules

Published:2017-05 Issue: Volume: Page:
ISSN:
Container-title:2017 IEEE International Electric Machines and Drives Conference (IEMDC)
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Author:

Niu He

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7995554/8001859/08002341.pdf?arnumber=8002341

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Review of Partial Discharge in Medium Voltage SiC Power Modules Under Square Wave Excitation: Characterization, Mitigation, and Detection;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08

2. Studying the Effects of Prolonged Thermal Stress Aiming to Induce Artificial Aging on DRAM Retention-Based Physical Unclonable Functions;2024 IEEE International Conference on Consumer Electronics (ICCE);2024-01-06

3. Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling;Journal of Electronic Materials;2024-01-05

4. Methods of Measurement of Die Temperature of Semiconductor Elements: A Review;Energies;2023-03-08

5. Overview of Current Thermal Management of Automotive Power Electronics for Traction Purposes and Future Directions;IEEE Transactions on Transportation Electrification;2022-06

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