Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules-Reference-Cited by-同舟云学术

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Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 IEEE Power Electronics Specialists Conference
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Author:

Coppola L.,Huff D.,Wang F.,Burgos R.,Boroyevich D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4341939/4341940/04342356.pdf?arnumber=4342356

Cited by 78 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation;Composites Part B: Engineering;2024-07

3. Dielectric Properties and Microstructure of Silicone Gel at Different Thermal Aging Stages;IEEE Transactions on Dielectrics and Electrical Insulation;2024-06

4. Electrical Properties of Epoxy-Nano Diamond Composite Films for Microelectronics Packaging Applications;2024 IEEE Latin American Electron Devices Conference (LAEDC);2024-05-08

5. Effects of Cross-Linking Density on the Breakdown Characteristics of Silicone Gels for Power Device Encapsulation;Springer Proceedings in Physics;2024

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