Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules-Reference-Cited by-同舟云学术

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Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 IEEE Power Electronics Specialists Conference
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Author:

Coppola L.,Huff D.,Wang F.,Burgos R.,Boroyevich D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4341939/4341940/04342356.pdf?arnumber=4342356

Cited by 72 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Double-Sided Cooled Split-Phase SiC Power Module With Fuzz Button Interposer;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-10

2. Thermal reliability of Cu sintering joints for high-temperature die attach;Microelectronics Reliability;2023-08

3. Direct bonding of Ni nanoparticles to a semiconductor Al electrode in air and its form;Welding International;2023-07-25

4. Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach;Journal of Materials Science: Materials in Electronics;2023-07

5. Single-Phase Jet Impingement Cooling for a Power-Dense Silicon Carbide Power Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05

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