Dielectric Properties and Microstructure of Silicone Gel at Different Thermal Aging Stages
Author:
Affiliation:
1. School of Electrical Engineering and Automation, Wuhan University, Wuhan, China
2. Guangdong Power Grid Company, Guangzhou, China
3. State Grid Chongqing Electric Power Research Institute, Chongqing, China
Funder
National Natural Science Foundation of China
Hubei Science Fund for Distinguished Young Scholars
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/94/10543207/10472085.pdf?arnumber=10472085
Reference23 articles.
1. 3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices
2. Overview of high voltage sic power semiconductor devices: development and application
3. Altitude Readiness of High-Voltage IGBTs Subjected to the Partial Discharge at Harsh Environmental Conditions for Hybrid Electric Aircraft Propulsion
4. Silicone Gel-Injection: Extending the Life of Secondary Service Cable
5. Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules
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