Author:
Liu Haiyan,Lin Tingyu,Hou Fengze,Fengchen ,Zhang Hengyun,Cao Liqiang
Cited by
3 articles.
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1. High-precision positioning detection technology for large-size fan-out panel-level package chips;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
2. Research on the yield optimization scheme of ESD devices based on FOPLP packaging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
3. An RDL-First Fan-Out Panel-Level Package for Heterogeneous Integration Applications;2019 IEEE 69th Electronic Components and Technology Conference (ECTC);2019-05