Modeling and characterization of the bonding-wire interconnection for microwave MCM-Reference-Cited by-同舟云学术

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Modeling and characterization of the bonding-wire interconnection for microwave MCM

Published:2010-08 Issue: Volume: Page:
ISSN:
Container-title:2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
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Author:

Liang ,Huang ChunYue ,Wang Wangang

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5570125/5582326/05582690.pdf?arnumber=5582690

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A High-Power GaAs Amplifier With Coupled Bonding-Wires-Based Harmonic Control Output Matching Network;IEEE Microwave and Wireless Technology Letters;2023-09

2. Equivalent Circuit Based Performance Coupling Analysis Method for Lead Wire Interconnection with Defects;Electronics;2020-04-13

3. Optimization Design of Fixed-Length Bond-Wire Interconnection in Multichips Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-11

4. Simple and low‐loss flip‐chip bonding based on ink‐jet printing for RF applications;Electronics Letters;2018-12

5. Fast and Accurate Frequency-Dependent Behavioral Model of Bonding Wires;IEEE Transactions on Industrial Informatics;2017-10

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