Simple and low‐loss flip‐chip bonding based on ink‐jet printing for RF applications-Reference-Cited by-同舟云学术

Simple and low‐loss flip‐chip bonding based on ink‐jet printing for RF applications

Published:2018-12 Issue:25 Volume:54 Page:1440-1442
ISSN:0013-5194
Container-title:Electronics Letters
language:en
Short-container-title:Electron. lett.

Author:

Kang H.L.¹,Lee Y.S.¹,Sim S.M.¹,Yu J.H.²,Shin K.Y.²,Lee S.H.²,Kim J.M.¹

Affiliation:

1. Department of Electronics and Information EngineeringChonbuk National UniversityBaekje‐daero 567Deokjin‐guJeonju54896Republic of Korea

2. Research Institute of Industrial Technology Convergence, Korea Institute of Industrial Technology (KITECH)143, Hanggaul‐roSangnok‐guAnsan‐si15588Republic of Korea

Funder

Chonbuk National University

National Research Foundation of Korea

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2018.7390

Reference10 articles.

1. Overlay high‐density interconnect: a chips‐first multichip module technology;Daum W.;Computer,1993

2. Wafer‐level parylene packaging with integrated RF electronics for wireless retinal prostheses;Li W.;J. Microelectromech. Syst.,2010

3. Flip-Chip-Assembled $W$-Band CMOS Chip Modules on Ceramic Integrated Passive Device With Transition Compensation for Millimeter-Wave System-in-Package Integration

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