1. Joule heating investigation for advanced interconnect schemes with airgaps
2. Joule Heating study in scaled Cu, Co and Ru interconnects;lofrano;2019 IEEE International Interconnect Technology Conference (IITC),2019
3. Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages;oprins;Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels Microchannels and Minichannels Volume 1 Thermal Management,2015
4. Reliability of a DME Ru Semidamascene scheme with 16nm wide Airgaps;lesniewska;IEEE International Reliability Physics Symposium (IRPS),2021
5. Reliability study on cobalt and ruthenium as alternative metals for advanced interconnects