Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints-Reference-Cited by-同舟云学术

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Correlation of Scanning Acoustic Microscopy and Transient Thermal Analysis to Identify Crack Growth in Solder Joints

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Schmid Maximilian¹,Hermann Joseph¹,Liu E¹,Elger Gordon¹

Affiliation:

1. Technische Hochschule Ingolstadt,Institute of Innovative Mobility,Ingolstadt,Germany

Funder

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899664.pdf?arnumber=9899664

Reference9 articles.

1. Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization

2. Automatic Panel Level Transient Thermal Tester;elger;LED professional Symposium + Expo 2017,2017

3. Transient thermal simulation of high power LED and its challenges

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability;IEEE Transactions on Device and Materials Reliability;2023-09

2. Crack Growth Prediction in High-Power LEDs from TTA, SAM and Simulated Data;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28

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