Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II

Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability

Author:

Schmid Maximilian¹^ORCID,Zippelius Andreas¹^ORCID,Hanß Alexander¹^ORCID,Böckhorst Stephan²,Elger Gordon¹^ORCID

Affiliation:

1. Institute of Innovative Mobility, Technische Hochschule Ingolstadt, Ingolstadt, Germany

2. LTH-TC-EP (Electronic Packaging), HELLA GmbH & Co. KGaA, Lippstadt, Germany

Funder

Bavarian Ministry of Science and Art through the Project IQLED

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

Reference31 articles.

3. Detection of defects at BGA solder joints by using X-ray imaging;ma;Proc 2005 Int Conf Machine Learn Cybern,2005

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