Thermal analysis of advanced back-end-of-line structures and the impact of design parameters
Author:
Affiliation:
1. KU Leuven,Dept. Material. Eng.,Leuven,Belgium
2. Imec,Leuven,Belgium
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9899435/9899496/09899564.pdf?arnumber=9899564
Reference21 articles.
1. A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures
2. Thermal characterization and challenges of advanced interconnects (Invited)
3. Measurement of back end of line thermal resistance for 3D chip stacks
4. Thermal resistance modeling of back-end interconnect and intrinsic FinFETs, and transient simulation of inverters with capacitive loading effects
5. Experimental extraction of BEOL composite equivalent thermal conductivities for application in self-heating simulations
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1. Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices;Electronics;2023-10-25
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