A Simple Extraction Method of Thermal Resistance in Multifinger GaAs HBT
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/7473958/07463485.pdf?arnumber=7463485
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Knowledge-Guided Neural Network-Based Large-Signal Model for InP HBTs With Self-Heating Effect Consideration;IEEE Transactions on Microwave Theory and Techniques;2024
2. An Accurate Electro-Thermal Coupling Model of a GaAs HBT Device under Floating Heat Source Disturbances;Micromachines;2023-12-13
3. Electro-Thermal Investigation of SiGe HBTs: A Review;2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS);2023-10-16
4. Optimizing Finger Spacing in Multifinger Bipolar Transistors for Minimal Electrothermal Coupling;IEEE Transactions on Electron Devices;2022-12
5. Characterization and Modeling of Thermal Coupling in Multi-Finger InP DHBTs;2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS);2022-10-16
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