Optimizing Finger Spacing in Multifinger Bipolar Transistors for Minimal Electrothermal Coupling-Reference-Cited by-同舟云学术

Optimizing Finger Spacing in Multifinger Bipolar Transistors for Minimal Electrothermal Coupling

Published:2022-12 Issue:12 Volume:69 Page:6535-6540
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Gupta Aakashdeep¹^ORCID,Nidhin K.¹^ORCID,Balanethiram Suresh²^ORCID,Yadav Shon³^ORCID,Fregonese Sebastien⁴^ORCID,Zimmer Thomas⁴^ORCID,Chakravorty Anjan¹^ORCID

Affiliation:

1. Department of Electrical Engineering, IIT Madras, Chennai, India

2. Department of Electronics and Communication Engineering, National Institute of Technology Puducherry, Puducherry, India

3. Device Modeling, Globalfoundries, Bengaluru, Karnataka, India

4. IMS Laboratory, University of Bordeaux, Talence, France

Funder

EU through Project Taranto

ISRO project

byDST, India

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/9967813/09932592.pdf?arnumber=9932592

Reference23 articles.

1. Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers

2. Boosting up performance of power SiGe HBTs using advanced layout concept

3. Improvement of thermal stability of multi-finger power SiGe HBTs using emitter-ballasting-resistor-free designs

4. Static Thermal Coupling Factors in Multi-Finger Bipolar Transistors: Part I—Model Development

5. Static Thermal Coupling Factors in Multi-Finger Bipolar Transistors: Part II-Experimental Validation

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1. Electro-Thermal Investigation of SiGe HBTs: A Review;2023 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS);2023-10-16

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