Realization of sub-4 µm Laser Microvia on ABF-Reference-Cited by-同舟云学术

Realization of sub-4 µm Laser Microvia on ABF

Published:2023-10-25 Issue: Volume: Page:
ISSN:
Container-title:2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
language:
Short-container-title:

Author:

Otsu Toshio¹,Tani Shuntaro¹,Nakazato Tomoharu¹,Tamaru Hiroharu²,Sakaue Kazuyuki³,Okada George⁴,Nakamura Naoyuki⁵,Nishimae Junichi⁵,Miyamoto Ryo⁶,Kobayashi Yohei¹

Affiliation:

1. The University of Tokyo,The Institute for Solid State Physics,Kashiwa,Chiba,Japan,277–8581

2. University of Tokyo,Graduate School of Science,Bunkyo,Tokyo,Japan,113–0033

3. University of Tokyo,Graduate School of Engineering,Bunkyo,Tokyo,Japan,113–8656

4. Specteronix Co.,Suita,Osaka,Japan,564–0062

5. Advanced Technology R&D Center,Mitsubishi Electric Co.,Amagasaki,Hyogo,Japan,661–8661

6. Ajinomoto Fine-Techno Co. Inc.,R&D 3G,Kawasaki,Kanagawa,Japan,210–0801

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10348606/10348630/10348653.pdf?arnumber=10348653

Reference4 articles.

1. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

2. Cyber-Physical System of laser micro processing for semiconductor package fabrication

3. Fully Automated Data Acquisition for Laser Production Cyber-Physical System

4. High-power DUV picosecond pulse laser with a gain-switched-LD-seeded MOPA and large CLBO crystal

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser micro drilling of around 3 microns into Ajinomoto Build-up Film;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28