Cyber-Physical System of laser micro processing for semiconductor package fabrication-Reference-Cited by-同舟云学术

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Cyber-Physical System of laser micro processing for semiconductor package fabrication

Published:2022-10-26 Issue: Volume: Page:
ISSN:
Container-title:2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
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Author:

Kobayashi Yohei¹,Tamaru Hiroharu²,Sakaue Kazuyuki³,Sakurai Haruyuki¹,Shimahara Kohei¹,Endo Tsubasa¹,Tani Shuntaro¹

Affiliation:

1. The Institute for Solid State Physics, The University of Tokyo, Kashiwanoha,Kashiwa,Japan,277-8581

2. The University of Tokyo, Hongo,Graduate School of Science,Bunkyo,Japan,113-0033

3. The University of Tokyo, Hongo,Graduate School of Engineering,Bunkyo,Japan,113-8656

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9966654/9966628/09966708.pdf?arnumber=9966708

Reference4 articles.

1. Autonomous parameter optimization for femtosecond laser micro-drilling

2. Ultrafast laser ablation simulator using deep neural networks

3. Fully Automated Data Acquisition for Laser Production Cyber-Physical System

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Realization of sub-4 µm Laser Microvia on ABF;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

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