Needs and applications of high temperature LSIs for automotive electronic systems-Reference-Cited by-同舟云学术

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Needs and applications of high temperature LSIs for automotive electronic systems

Published: Issue: Volume: Page:
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Container-title:HITEN 99. Third European Conference on High Temperature Electronics. (IEEE Cat. No.99EX372)
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Author:

Hattori M.

Publisher

AEA Technol

Link

http://xplorestaging.ieee.org/ielx5/6705/17929/00827345.pdf?arnumber=827345

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Bi-Content on the High Strain Rate Properties of SnAgCu Solders Under Sustained High-Temperature Operation;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Research on the Latch-Up Mechanism of DSOI at High Temperature;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14

3. Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method;Journal of Electronic Packaging;2023-11-10

4. Shock and Vibration Simulation for PBGA Board Assemblies with SAC Solder Interconnects using Non-Linear High Strain Rate Properties;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30

5. Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-free Solders in Temperature Range of -65°C to +200°C after 1-Year Sustained High Temperatures Exposure;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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