Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding Structure-Reference-Cited by-同舟云学术

Scheme for Multi-Chiplet Integration With Low Thermal Budget by Asymmetric Cu-Cu Bonding With Au Passivation Bonding Structure

Author:

Hong Zhong-Jie¹,Weng Ming-Wei²,Chen Chih-Han¹,Hsu Mu-Ping²,Hu Han-Wen²^ORCID,Lin Tai-Yu²,Hung Ying-Chan³,Chen Kuan-Neng¹^ORCID

Affiliation:

1. International College of Semiconductor Technology, National Yang-Ming Chiao Tung University, Hsinchu, Taiwan

2. Institute of Electronics, National Yang-Ming Chiao Tung University, Hsinchu, Taiwan

3. Solar Applied Materials Technology Company Ltd., Tainan, Taiwan

Funder

National Science and Technology Council, Taiwan

Ministry of Education

Semiconductor Research Corporation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

Reference16 articles.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

4. Low Temperature Cu/SiO₂ Hybrid Bonding with Protruding Copper Pads;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28