Single Event Effect prediction early in the design phase and latchup case study on ASIC
Author:
Funder
CNES
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9328647/9328648/09328701.pdf?arnumber=9328701
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Proposal of a Multiscale High Accuracy Engineering Approach for Single-Event Effects Analysis in Modern Technologies;IEEE Transactions on Nuclear Science;2024-08
2. Pulsed X-rays Induced Single Event Effects in Si, SiC and GaN Technologies;2022 22nd European Conference on Radiation and Its Effects on Components and Systems (RADECS);2022-10-03
3. Electron induced SEU and MBU sensitivity of 20-nm planar and 16-nm FinFET SRAM-based FPGA;2020 20th European Conference on Radiation and Its Effects on Components and Systems (RADECS);2020-10
4. Cross-Calibration of Various SEE Test Methods Including Pulsed X-rays and Application to SEL and SEU;2019 19th European Conference on Radiation and Its Effects on Components and Systems (RADECS);2019-09
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