A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method-Reference-Cited by-同舟云学术

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A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method

Published:2012-06 Issue:6 Volume:22 Page:303-305
ISSN:1531-1309
Container-title:IEEE Microwave and Wireless Components Letters
language:
Short-container-title:IEEE Microw. Wireless Compon. Lett.

Author:

Cheng Tai-Yu,Wang Chuen-De,Chiou Yih-Peng,Wu Tzong-Lin

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics

Link

http://xplorestaging.ieee.org/ielx5/7260/6210431/06202384.pdf?arnumber=6202384

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Deep-Learning Approach for Wideband Design of 3D TSV-Based Inductors;IEEE Access;2022

2. Channel Characteristic-Based Deep Neural Network Models for Accurate Eye Diagram Estimation in High Bandwidth Memory (HBM) Silicon Interposer;IEEE Transactions on Electromagnetic Compatibility;2021

3. Accurate Modeling of the Capacitance of Through-Silicon Via Considering Minority Carrier Effects;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-05

4. Broadband inductance modeling of TXVs for 3D interconnection;Microelectronics Journal;2019-06

5. Modeling and Fabrication Aspects of Cu- and Carbon Nanotube-Based Through-Silicon Vias;IETE Journal of Research;2018-12-23

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