Broadband inductance modeling of TXVs for 3D interconnection
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
General Engineering
Reference15 articles.
1. Impact of TSV location in HVIC on CMOS operation: A mixed-mode TCAD simulation study
2. Speeding Up PEEC Partial Inductance Computations Using a QR-Based Algorithm
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