Advantage and challenge of coreless flip-chip BGA-Reference-Cited by-同舟云学术

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Advantage and challenge of coreless flip-chip BGA

Published:2007 Issue: Volume: Page:
ISSN:
Container-title:2007 International Microsystems, Packaging, Assembly and Circuits Technology
language:
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Author:

Lin Elva,Chang David,Don-Son Jiang ,Wang Y. P.,Hsiao C. S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4433550/4433551/04433633.pdf?arnumber=4433633

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of pre-soldering temperatures on the microstructures and shear behaviors of SnBi-SAC/ENIG solder joints;Journal of Materials Science: Materials in Electronics;2024-05

2. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

3. Heterogeneous Integrations on Organic Substrates;Heterogeneous Integrations;2019

4. Flip Chip Technology Versus FOWLP;Fan-Out Wafer-Level Packaging;2018

5. Recent Advances and New Trends in Flip Chip Technology;Journal of Electronic Packaging;2016-07-25

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