1. Tsukada, Y., S. Tsuchida, and Y. Mashimoto, “Surface Laminar Circuit Packaging”, 42nd IEEE Electronic and Components Technology Conference, San Diego, CA, May, 1992, pp. 22–27.
2. Tsukada, Y., and S. Tsuchida, “Surface Laminar Circuit, a Low Cost High Density Printed Circuit Board”, Surface Mount International Conference, San Jose, CA, August 27–29, 1992, pp. 537–542.
3. Tsukada, Y. “Solder Bumped Flip Chip Attach on SLC Board and Multichip Module”, in Chip on Board Technologies for Multichip Modules, ed. J. H. Lau, 410–443. New York: Van Nostrand Reinhold, 1994.
4. Tsukada, Y., Y. Maeda, and K. Yamanaka, “A Novel Solution for MCM-L Utilizing Surface Laminar Circuit and Flip Chip Attach Technology”, Proceedings of 2nd International Conference on Multichip Modules, April 1993, pp. 252–259.
5. Lau, J. H., and S. W. R. Lee, Microvias for Low Cost, High Density Interconnects. New York: McGraw-Hill, 2001.