A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding-Reference-Cited by-同舟云学术

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A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding

Published:2009-04 Issue:4 Volume:56 Page:1079-1085
ISSN:0278-0046
Container-title:IEEE Transactions on Industrial Electronics
language:
Short-container-title:IEEE Trans. Ind. Electron.

Author:

Bong-Hwan Kim ,Jong-Bok Kim ,Jong-Hyun Kim

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Control and Systems Engineering

Link

http://xplorestaging.ieee.org/ielx5/41/4808369/04682710.pdf?arnumber=4682710

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