Wiring techniques for large size silicon probe using electroplating-Reference-Cited by-同舟云学术

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Wiring techniques for large size silicon probe using electroplating

Published:2020-07-16 Issue:10 Volume:103 Page:44-52
ISSN:1942-9533
Container-title:Electronics and Communications in Japan
language:en
Short-container-title:Electron Comm Jpn

Author:

Aono Takanori¹,Kanamaru Masatoshi¹,Kohno Ryuji¹,Hosogane Atsushi¹

Affiliation:

1. Center for Technology Innovation—Mechanical Engineering, Research & Development Group Hitachi, Ltd. Hitachinaka Ibaraki Japan

Publisher

Wiley

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Networks and Communications,General Physics and Astronomy,Signal Processing

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/ecj.12266

Reference6 articles.

1. TanakaS FujimotoS ItoO ChoeS‐H EsashiM. Fabrication of microprobes on a ultarathick glass substrate with narrow‐pitch electrical feed throughs for ext‐generation LSI Burn‐in tests.Technical Digest MEMS2008 2008;347‐350.

2. A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding

3. Probe card with probe pins grown by the vapor-liquid-solid (VLS) method

4. A micromachined array probe card-fabrication process

5. Development of Micro-Probe Substrate for LSI Testing

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