Affiliation:
1. Hitachi, Ltd.
2. Hitachi industries co, Ltd.
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Reference9 articles.
1. Trend of BGACSPKGD. Current Status and Issues of Bare Chip Burn-In Technology-Report on Panel Discussion.
2. 2) VLSI Report: No157, pp. 27-29 (1997)
3. Trend of BGACSPKGD. A Wafer-Level Burn-in Technology.
4. 6) Yanwei Zhang, Yongxia Zhang, Dan Worsham, Dan Morrow, R.B. Marcus: A NEW MEMS WAFER PROBE CARD, Proc. MEMS97, IEEE Catalog No97CH36021 pp. 395-399 (1997)
5. 7) Takahiro Ito, Renshi Sawada, Eiji Higurashi: MICRO IC PROBE FOR LSI TESTING, Proc. MEMS99, IEEE Catalog No99CH36291C pp. 263-266 (1999)
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