A Study of the Method to Dice the Microdevice Processed with Si-Micromachining-Reference-Cited by-同舟云学术

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A Study of the Method to Dice the Microdevice Processed with Si-Micromachining

Published:2004 Issue:2 Volume:124 Page:37-42
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Naniwa Irizo¹,Nezu Yuichi²

Affiliation:

1. Renesas Technology Corp., Manufacturing Technology Unit

2. Renesas Technology Corp., Kofu Factory

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://www.jstage.jst.go.jp/article/ieejsmas/124/2/124_2_37/_pdf

Reference8 articles.

1. (1) I. Naniwa and Y. Nezu : “Evaluation of a Method to Dice Microdevices Processed with Si-Micromachining”, National Convention Record I.E.E., No. 3, p. 202 (2003) (in Japanese)

2. ????·????:?????????????????????,???????????,No. 3, p. 202 (2003)

3. Development of Micro-Probe Substrate for LSI Testing

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