Abstract
A comprehensive overview of PowderMEMS—a novel back-end-of-line-compatible microfabrication technology—is presented in this paper. The PowderMEMS process solidifies micron-sized particles via atomic layer deposition (ALD) to create three-dimensional microstructures on planar substrates from a wide variety of materials. The process offers numerous degrees of freedom for the design of functional MEMSs, such as a wide choice of different material properties and the precise definition of 3D volumes at the substrate level, with a defined degree of porosity. This work details the characteristics of PowderMEMS materials as well as the maturity of the fabrication technology, while highlighting prospects for future microdevices. Applications of PowderMEMS in the fields of magnetic, thermal, optical, fluidic, and electrochemical MEMSs are described, and future developments and challenges of the technology are discussed.
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Reference57 articles.
1. Challenges, developments and applications of silicon deep reactive ion etching;Microelectron. Eng.,2003
2. (2021, March 23). LIDE Technology. Available online: https://www.vitrion.com/en/lide-technology/.
3. Gower, M.C. (2001, January 1). Laser micromachining for manufacturing MEMS devices. Proceedings of the Micromachining and Microfabrication, San Francisco, CA, USA.
4. Patil, D.R., Annapureddy, V., Kaarthik, J., Thakre, A., Akedo, J., and Ryu, J. (2020). Piezoelectric Thick Film Deposition via Powder/Granule Spray in Vacuum: A Review. Actuators, 9.
5. Chikuba, Y., Oryoshi, M., Yamashita, A., Nakano, M., Yanai, T., and Fukunaga, H. (2015, January 11–15). Nd-Fe-B film magnets with the thickness above 100 μm deposited on Si substrates. Proceedings of the 2015 IEEE Magnetics Conference (INTERMAG), Beijing, China.
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献