An Analytical Model for Thin Film Pattern-dependent Asymmetric Wafer Warpage Prediction
Author:
Affiliation:
1. Western Digital Corporation,Milpitas,CA,USA
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9779263/9779243/09779248.pdf?arnumber=9779248
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1. Residual stress measurement in coated plates using layer growing/removing methods: 100th anniversary of the publication of Stoney's paper “The tension of metallic films deposited by electrolysis;kõo;Materials Science Forum,2011
2. Past and Future of 3D Flash
3. Analysis of Asymmetric Warpage of Thin Wafers on Flat Plate Considering Bifurcation and Gravitational Force
4. Multi-scale Modeling Approach to Assess and Mitigate Wafer Warpage in 3-D NAND Fabrication
5. Analyzing and modeling methods for warpages of thin and large dies with redistribution layer
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