Author:
Dote Aki,Kitada Hideki,Mizushima Yoriko,Nakamura Tomoji,Sakuyama Seiki
Subject
General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering
Cited by
2 articles.
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1. An Analytical Model for Thin Film Pattern-dependent Asymmetric Wafer Warpage Prediction;2022 IEEE International Memory Workshop (IMW);2022-05
2. On the Way to understand the Warpage in 8” Taiko Semiconductor Wafers for Power Electronics Applications (Si and SiC);2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19