登录 注册 会员服务 联系我们

A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM)

  • Published:2020-12-07 Issue: Volume: Page:
  • ISSN:
  • Container-title:2020 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO)
  • language:
  • Short-container-title:

Author:

Son Keeyoung,Kim Subin,Park Hyunwook,Kim Seongguk,Kim Keunwoo,Park Shinyoung,Sim Boogyo,Jeong Seungtaek,Park Gapyeol,Kim Joungho

Funder

National Research Foundation of Korea

Publisher

IEEE

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Analysis of High Bandwidth Memory (HBM)-GPU Module considering Power Consumption;2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2023-12-12

2. Tangible interaction technique with authoring capability for kitchen design;Multimedia Tools and Applications;2023-01-20

3. Power Distribution Network Impedance Analysis considering Thermal Distribution;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12

4. Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM);IEEE Transactions on Microwave Theory and Techniques;2022-11

5. Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09
同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3