Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM)

Author:

Park Hyunwook1ORCID,Kim Minsu1,Kim Seongguk1ORCID,Kim Keunwoo1ORCID,Kim Haeyeon1,Shin Taein1ORCID,Son Keeyoung1ORCID,Sim Boogyo1ORCID,Kim Subin2,Jeong Seungtaek3ORCID,Hwang Chulsoon3ORCID,Kim Joungho1ORCID

Affiliation:

1. School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, South Korea

2. Samsung Electronics, Suwon, South Korea

3. Department of Electrical and Computer Engineering, Missouri University of Science and Technology, Rolla, MO, USA

Funder

National Research and Development Program through the National Research Foundation of Korea (NRF), Ministry of Science and ICT

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Reference43 articles.

1. A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM)

2. Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme

3. Neural combinatorial optimization with reinforcement learning;bello;Proc Int Conf Learn Represent (ICLR),2017

4. Deep Residual Learning for Image Recognition

5. Attention, learn to solve routing problems!;kool;Proc Int Conf Learn Represent (ICLR),2019

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2. Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-11

3. Versatile Genetic Algorithm-Bayesian Optimization(GA-BO) Bi-Level Optimization for Decoupling Capacitor Placement;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15

4. Design and Analysis of an Irregular-Shaped Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15

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