Reliability Study of 1T1C FeRAM Arrays With Hf0.5Zr0.5O₂ Thickness Scaling
Author:
Affiliation:
1. Research Division 1, Sony Semiconductor Solutions Corporation, Atsugi, Japan
2. NaMLab gGmbH, Dresden, Germany
3. Fraunhofer IPMS—Center Nanoelectronics Technologies, Dresden, Germany
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Biotechnology
Link
http://xplorestaging.ieee.org/ielx7/6245494/9714452/09810188.pdf?arnumber=9810188
Reference23 articles.
1. Improved State Stability of HfO2 Ferroelectric Tunnel Junction by Template-Induced Crystallization and Remote Scavenging for Efficient in-Memory Reinforcement Learning
2. Demonstration of BEOL-compatible ferroelectric Hf0.5Zr0.5O? scaled FeRAM co-integrated with 130 nm CMOS for embedded NVM applications;francois;Proc IEEE Int Electron Devices Meeting (IEDM),2019
3. SoC Compatible 1T1C FeRAM Memory Array Based on Ferroelectric Hf0.5Zr0.5O2
4. 1T1C FeRAM memory array based on ferroelectric HZO with capacitor under bitline
5. Built-In Bias Generation in Anti-Ferroelectric Stacks: Methods and Device Applications
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1. Role of charge injection/de-trapping in imprint behavior of ferroelectric Hf0.5Zr0.5O2 thin film;Applied Physics Letters;2024-08-12
2. Effect of electrical stress on time dependent dielectric breakdown (TDDB) tolerate capability of HfO2–ZrO2 ferroelectric films with different thicknesses;Nanotechnology;2024-06-24
3. Comprehensive Reliability Assessment of 32Gb (Hf,Zr)O2-Based Ferroelectric NVDRAM;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14
4. Dielectric breakdown behavior of ferroelectric HfO2 capacitors by constant voltage stress studied by in situ laser-based photoemission electron microscopy;Japanese Journal of Applied Physics;2024-02-05
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