1. Hybrid Double-Side Cooled Package for Multichip GaN Power Module With Optimal Current Sharing at High Switching Speed;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08
2. The First Investigation of Switching Lifetime on Parallel-Connected GaN Power Devices;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14
3. Design and Analysis of a High Current GaN Based PCB for Dual Active Bridge Converter for Electric Aircraft Applications;2024 IEEE Applied Power Electronics Conference and Exposition (APEC);2024-02-25
4. Application-Oriented Characterization of Thermally Optimized, Asymmetrical Single Chip Packages for 100 V GaN HEMTs;2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD);2023-05-28
5. Design and efficiency measurement of a sub-unit for a 20kW DC-DC multiphase power converter;2023 IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference (ESARS-ITEC);2023-03-29