1. Thermal impedance evaluation of optimized pcb-based gan hemt single-chipprepackage using vgs method;ghebreslassie;Elektronische Baugruppen und Leiterplatten EBL 2022 DVS-Berichte Band 375,2022
2. Test Methods and Principles of Thermal Resistance for GaN HEMT Power Devices
3. Asymmetric packages for optimal performance of gan-hemt using pcb fabrication technology;sharma;PCIM Europe 2021 International Exhibition and Conference for Power Electronics Intelligent Motion Renewable Energy and Energy Management,0
4. Thermal study on leadframe dimensioning for high power dissipation and low inductance commutation cells;weimer;PCIM Europe 2020 International Exhibition and Conference for Power Electronics Intelligent Motion Renewable Energy and Energy Management,0