Methodology for standard cell compliance and detailed placement for triple patterning lithography
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/6679730/6691081/06691142.pdf?arnumber=6691142
Cited by 27 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Via Pillar-aware Detailed Placement;Proceedings of the 2020 International Symposium on Physical Design;2020-03-20
2. Triple Patterning Aware Detailed Placement Toward Zero Cross-Row Middle-of-Line Conflict;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2017-07
3. Vertical M1 Routing-Aware Detailed Placement for Congestion and Wirelength Reduction in Sub-10nm Nodes;Proceedings of the 54th Annual Design Automation Conference 2017;2017-06-18
4. Stitch aware detailed placement for multiple E-beam lithography;Integration;2017-06
5. Toward Unidirectional Routing Closure in Advanced Technology Nodes;IPSJ Transactions on System LSI Design Methodology;2017
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