Author:
Lee Young-Joon,Lim Sung Kyu
Cited by
3 articles.
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1. Physical Design for 3D ICs;Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology;2016-04-14
2. A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs;Integration;2014-06
3. TSV-to-TSV Coupling Analysis and Optimization;Design for High Performance, Low Power, and Reliable 3D Integrated Circuits;2012-09-24