300mm Heterogeneous 3D Integration of Record Performance Layer Transfer Germanium PMOS with Silicon NMOS for Low Power High Performance Logic Applications-Reference-Cited by-同舟云学术

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300mm Heterogeneous 3D Integration of Record Performance Layer Transfer Germanium PMOS with Silicon NMOS for Low Power High Performance Logic Applications

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE International Electron Devices Meeting (IEDM)
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Author:

Rachmady W.,Jun K.,Krist B.,Metz M.,Michaelos T.,Mueller B.,Oni A. A.,Paul R.,Phan A.,Sears P.,Talukdar T.,Agrawal A.,Torres J.,Turkot R.,Wong L.,Yoo H. J.,Kavalieros J.,Sung S.H.,Dewey G.,Chouksey S.,Chu-Kung B.,Elbaz G.,Fischer P.,Huang C. Y.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8971803/8993428/08993626.pdf?arnumber=8993626

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