Investigation on the reliability risk for high density Fan-Out packages

Author:

Lin Yu-Ting,Chang Yu-Ren,Lin Yi-Sheng,Hsiao Yu-Hsiang

Publisher

IEEE

Reference5 articles.

1. An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

2. Development and Characterization of New Generation Panel Fan-out (PFO) Packaging Technology;chang;Electronic Components and Technology Conference (ECTC),2014

3. High-density fan-out technology for advanced SiP and 3D heterogeneous integration

4. First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration

5. SLIMTM, High Density Wafer Level Fan-out Package Development with Submicron RDL;kim;Electronic Components and Technology Conference (ECTC),2017

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Micro-Defect Failure Analysis in Fan-Out Package and Correspond to Finite Element Method (FEM) Simulation Results;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25

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