Acoustic Emission in Power Semiconductor Modules—First Observations-Reference-Cited by-同舟云学术

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Acoustic Emission in Power Semiconductor Modules—First Observations

Published:2014-11 Issue:11 Volume:29 Page:6081-6086
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Karkkainen Tommi J.,Talvitie Joonas P.,Kuisma Mikko,Hannonen Janne,Strom Juha-Pekka,Mengotti Elena,Silventoinen Pertti

Funder

ABB Research

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/6850100/06690217.pdf?arnumber=6690217

Cited by 39 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Acoustic Characterization of Integrated Circuits During Operation;Journal of Electronic Packaging;2024-06-20

2. Analysis of Stress Wave Characteristics in SiC MOSFETs with Solder Layer Voids;2024 3rd International Conference on Energy, Power and Electrical Technology (ICEPET);2024-05-17

3. Analysis of the Influence of Temperature on Stress Waves of Cascode GaN HEMT;IEEE Sensors Journal;2024-04-15

4. A Novel Method for Diagnosing Power Electronics Devices Using Elastic Wave Emission;Energies;2023-11-02

5. Acoustic Emission Characteristics of SiC MOSFET Based on Flexible Sensor;2023 International Symposium on Electrical Insulating Materials (ISEIM);2023-09-24

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