Enhancing Flexibility in Power Electronics Production: A Study on Robotic Handling of Copper Clips for Laser Bonding
Author:
Affiliation:
1. Institute for Factory Automation and Production Systems Friedrich-Alexander University Erlangen-Nuremberg,Nuremberg,Germany
2. Technology Department Siemens Aktiengesellschaft,Munich,Germany
Funder
BMWK
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10374481/10374594/10374891.pdf?arnumber=10374891
Reference24 articles.
1. Automotive Power Module Packaging: Current Status and Future Trends
2. Applications and Future of Automated and Additive Manufacturing for Power Electronics Components and Converters
3. Development of High Power and High Junction Temperature SiC Based Power Packages
4. Laser bonding of copper ribbons and clips on SiC power MOSFETs with sintered copper bond buffers
5. A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues
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1. Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process;2024 32nd Mediterranean Conference on Control and Automation (MED);2024-06-11
2. A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
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