Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process

Author:

Ockel M.1,Meier S.,Stelter O. G.,Thielen N.,Bründl P.,Franke J.

Affiliation:

1. Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universitat Erlangen-Nümberg,Nümberg,Germany,90429

Funder

Federal Ministry for Economic Affairs and Energy (BMWi) as part of “FlaMe”

Publisher

IEEE

Reference12 articles.

1. Evaluation of the Cold Atmospheric Plasma Metallization of Bare Dies with Copper Through Life Cycle Assessment

2. Enhancing Flexibility in Power Electronics Production: A Study on Robotic Handling of Copper Clips for Laser Bonding

3. Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering;Ockel;ITSC,2024

4. Plasma Powder Copper Coating on silicon substrates for copper wire bonds in comparison to state-of-the-art top-side interconnection technologies;Ockel

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