Author:
Hu Dyi Chung,Chen Er Hao,Lee Jeffrey ChangBing,Sun Chia Peng,Hsu Chih Chung
Cited by
5 articles.
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1. Method of Triple Thin Film RDL Layers on 2.2D Substrate;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Optimization of 2.2D Underfill Process by Novel Methodology and Direct Observation of Capillary Underfill Process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. In-situ Observation of Underfill Dispensing Process;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
4. A Novel Modelling Methodology for Underfill Molding Process On 2.2D Heterogeneous Integrated Substrate;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26
5. A Novel Equivalent Model for Underfill Molding Process On 2.2D Structure for High Performance Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05