Scaling Solder Micro-Bump Interconnect Down to $10\ \mu\mathrm{m}$ Pitch for Advanced 3D IC Packages-Reference-Cited by-同舟云学术

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Scaling Solder Micro-Bump Interconnect Down to $10\ \mu\mathrm{m}$ Pitch for Advanced 3D IC Packages

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Li Zhaozhi,Tomita Yoshihiro,Elsherbini Adel A.,Liu Pilin,Sawyer Holly A.,Swan Johanna M.,Liff Shawna M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501923.pdf?arnumber=9501923

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition;ACS Applied Materials & Interfaces;2024-08-27

2. Effect of Joule heating on the reliability of microbumps in 3D IC;Journal of Materials Research and Technology;2024-07

3. A Study on Improvement and Extension of Fine-Pitch Micro-Bump Interconnects Technology: New Metallurgy & Flux-Less Oxide-removal Laser Assembly (FLOLA);2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Bump-Less Interconnect with Room Temperature Pre-Bondable Adhesive and Solder for High Throughput Chip Stacking;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. A Study of Chip-Package Interaction with All-Copper Interconnections on Advanced Glass Substrates;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

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