Multi-tier $\mathrm{N}=4$ Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501702.pdf?arnumber=9501702
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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5. Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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