3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications-Reference-Cited by-同舟云学术

3-layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator With High Density TSV For Advanced CMOS Image Sensor Applications

Published:2024-05-28 Issue: Volume: Page:305-311
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Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Nicolas Stéphane¹,Suarez-Berru Jerzy-Javier¹,Bresson Nicolas¹,Socquet-Clerc Carole¹,Assous Myriam¹,Borel Stéphan¹,Vélard Rémi¹,Dechamp Jérôme¹,Bouis Renan¹,Roman Antonio¹,Abadie Karine¹,Hebras Damien¹

Affiliation:

1. Univ. Grenoble Alpes,CEA, LETI, Grenoble,Grenoble,France

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565164.pdf?arnumber=10565164

Reference14 articles.

1. Recent Advances and Trends in Cu–Cu Hybrid Bonding

2. Development of 3-layer stacked global shutter CMOS image sensor with pixel pitch Cu-to-Cu interconnection and high-capacity capacitors

3. Development of face-to-face and face-to-back ultra-fine pitch Cu-Cu hybrid bonding

4. Pixel Pitch Hybrid Bonding and Three Layer Stacking Technology for BSI Image Sensor

5. Multi-tier $\mathrm{N}=4$ Binary Stacking, combining Face-to-Face and Back-to-Back Hybrid Wafer-to-Wafer Bonding Technology

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Backside Thinning Process Development for High-Density TSV in a 3-Layer Integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28