Direct Bonded Heterogeneous Integration (DBHi) Si Bridge-Reference-Cited by-同舟云学术

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Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Sikka Kamal,Bonam Ravi,Liu Yang,Andry Paul,Parekh Dishit,Jain Aakrati,Bergendahl Marc,Divakaruni Rama,Cournoyer Maryse,Gagnon Pascale,Dufort Catherine,de Sousa Isabel,Zhang Hongqing,Cropp Ed,Wassick Thomas,Mori Hiroyuki,Kohara Sayuri

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501935.pdf?arnumber=9501935

Cited by 28 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Local Thickness Control of Resist Mask Using Pad Density Dependence;Journal of The Japan Institute of Electronics Packaging;2024-08-01

2. High Power Thermal Test Vehicle with 2-Phase Cooling for AI Datacenters, 5G RAN, and EDGE Compute Nodes;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. High Precision and Productivity Bridge-die-last Bonding Process and Its Reliability for Pillar- Suspended Bridge (PSB) Architecture;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

5. Chiplet Communications (Bridges);Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024

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