Enabling D2W / D2D Hybrid Bonding on manufacturing equipment based on simulated process parameters
Author:
Affiliation:
1. Fraunhofer IZM-ASSID,Dresden-Moritzburg,Germany
2. Fraunhofer ENAS,Chemnitz,Germany
3. Fraunhofer IZM Berlin,Berlin,Germany
Funder
Department for science and arts of the federal state of Saxony and by the Fraunhofer Society
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501730.pdf?arnumber=9501730
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3. Cu Pumping Analysis During $\text{Cu}/\text{SiO}_{2}$ Hybrid Bonding Using In-Situ SPM Imaging;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
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